Semiconductor device including temperature ranges having temperature thresholds and method of determining therefor

ABSTRACT

A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges.

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 62/039,494, filed Aug. 20, 2014, the contents ofwhich are incorporated by reference herein.

TECHNICAL FIELD

The present invention relates generally to a semiconductor device, andmore particularly to testing and setting performance parameters in asemiconductor device.

BACKGROUND OF THE INVENTION

Semiconductor devices include components that have characteristics thatvary with respect to temperature. For example, as temperature increasesmobility of charge carriers decrease causing transistors, such asinsulated gate field effect transistors (IGFET) to have lower drivecurrent. Although drive current decreases, leakage current (leakagecurrent when the IGFET is turned off) increases. These temperaturedependent characteristics can make design problematic.

When designing a semiconductor device, the designer will design circuittiming and internally regulated power supply voltages for worst casecorners. Typically, a fast corner may be high voltage, low temperatureand a slow corner may be low voltage and high temperature. By designingcircuits in a semiconductor device for a worst case temperature, powermay be unnecessarily wasted at another temperature point. For example, apower supply may provide a voltage that is unnecessarily high at a firsttemperature point due to the necessity of ensuring specifications aremet at a second temperature point, even though the semiconductor devicerarely operates at the second temperature point. This can cause power tobe wasted at the first temperature point, which is where thesemiconductor device typically operates.

A specific example is an internal refresh operation in a dynamic randomaccess memory (DRAM). At a low temperature, charge on a DRAM capacitorin a DRAM memory cell may degrade more slowly than at high temperature.However, to ensure specifications are met, the frequency of refreshoperations may be unnecessarily high at low temperatures to ensure thehigh temperature case is met. This can cause unnecessary powerconsumption in typical operating temperatures.

Unnecessary power consumption is even more important in mobile devicesas it reduces battery lifetime.

In light of the above, it would be desirable to provide a semiconductordevice in which parameters may be varied with respect to operatingtemperature.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block schematic diagram of a semiconductor device accordingto an embodiment.

FIG. 2 is a circuit schematic diagram of temperature ranges set bytemperature sensor circuits according to an embodiment.

FIG. 3 is a flow diagram of a test method for a semiconductor deviceaccording to an embodiment.

FIG. 4 is a waveform diagram illustrating a test method for asemiconductor device according to an embodiment.

FIG. 5 is a waveform diagram illustrating a test method for asemiconductor device according to an embodiment.

FIG. 6 is a block schematic diagram illustrating a test apparatus thatcan test a semiconductor device according to an embodiment.

FIG. 7 is a schematic diagram illustrating a thermal source and a deviceunder test according to an embodiment.

FIG. 8 is a table stored in a test control apparatus according to anembodiment.

FIG. 9 is a flow diagram of a method of optimizing speed performanceover a wide range of temperatures according to an embodiment.

FIG. 10 is a timing diagram illustrating a portion of a test method fortesting a semiconductor device according to an embodiment.

FIG. 11 is a timing diagram illustrating writing performance parametersto a performance parameter table according to an embodiment.

FIG. 12 is a flow diagram of a method of optimizing power consumptionover a wide range of temperatures according to an embodiment.

FIG. 13 is a semiconductor wafer including a plurality of semiconductordevices according to an embodiment.

FIG. 14 is a block schematic diagram illustrating a test apparatus thatcan test a semiconductor device on a semiconductor wafer according to anembodiment.

FIG. 15 is a flow diagram of a method of testing and programmingsemiconductor devices on a semiconductor wafer according to anembodiment.

FIG. 16 is a flow diagram of a method of testing and programmingsemiconductor devices on a semiconductor wafer according to anembodiment.

FIG. 17 is a block schematic diagram of an example of operationalcircuits according to an embodiment.

FIG. 18 is a circuit schematic diagram of a register circuit accordingto an embodiment.

FIG. 19 is circuit schematic diagram of an input/output buffer circuitand pass gate circuit according to an embodiment.

FIG. 20 is a block schematic diagram of an example of operationalcircuits according to an embodiment.

FIG. 21 is a semiconductor wafer including a plurality of semiconductordevices according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

According to the embodiments set forth below, a semiconductor device caninclude a temperature sensing circuit that provides a temperature rangein accordance with the value of a counter. A counter may incrementallychange in accordance with a temperature of the semiconductor devicechanging outside of the bounds of the range. The count output of thecounter can be fed back to the temperature sensing circuit such that thetemperature range can change. Furthermore, the value of the counter mayselect parameters stored in a table to set performance parameters ofvarious operational circuits. A test can be performed over a temperaturerange to determine minimum and maximum temperature values for each ofthe plurality of ranges. Furthermore, a test may be performed todetermine performance parameters essentially optimized for eachtemperature range. The optimization may be performed for improved powerconsumption for a low power device or improved operational speeds for ahigh speed device.

Referring now to FIG. 1, a semiconductor device according to anembodiment is set forth in a block schematic diagram and given thegeneral reference character 100.

Semiconductor device 100 may include a reference voltage generator 110,temperature sensor circuits (120 and 130), and a counter circuit 140.Semiconductor device 100 may also include a pass gate circuit 145, countlimit detector 150, a transition detector 160, a performance parametertable 170, a control circuit 180, a power up circuit 190, operationalcircuits 195 input/output buffer circuit 196, counter circuit 198, andserial register circuit 199.

Voltage generator 110 may provide a reference voltage V_(BGREF) and areference voltage V_(TEMP). Reference voltage V_(BGREF) may be areference potential that is essentially independent of temperature.Reference voltage V_(BGREF) may be provided as a reference potential totemperature sensor circuits (120 and 130). Reference voltage V_(TEMP)may be provided as a temperature dependent potential to temperaturesensor circuits (120 and 130).

Temperature sensor circuit 120 may receive reference voltages (V_(BGREF)and V_(TEMP)), count limit signal MAX, count transition signal CTD,power up signal PUP, and count value CNT[n:1] as inputs and may providean increment signal INC as an output. Temperature sensor circuit 130 mayreceive reference voltages (V_(BGREF) and V_(TEMP)), count limit signalMIN, count transition signal CTD, power up signal PUP, and count valueCNT[n:1] as inputs and may provide decrement signal DEC as an output.Temperature sensor circuit 120 may provide a temperature range upperlimit value based on the count value CNT[n:1] and temperature sensorcircuit 130 may provide a temperature range lower limit value based onthe count value CNT[n:1]. Temperature sensor circuit 120 may provide anincrement signal INC that transitions to a logic high level in responseto sensing a temperature of semiconductor device 100 reaching thetemperature range upper limit value from within the current temperaturerange. Temperature sensor circuit 130 may provide a decrement signal DECthat transitions to a logic high level in response to sensing atemperature of semiconductor device 100 reaching the temperature rangelower limit value from within the current temperature range.

Counter circuit 140 may receive increment signal INC, decrement signalDEC, and power up signal PUP as inputs and may provide count valueCNT[n:1] as an output. Counter circuit 140 may incrementally increasecount value CNT[n:1] in response to increment signal INC transitioningfrom a logic low to a logic high level and may incrementally decreasecount value CNT[n:1] in response to decrement signal DEC transitioningfrom a logic low to a logic high level.

Pass gate circuit 145 may receive count value CNT[n:1], test signalTEST1, and input enable signal INEN as inputs and may have an outputconnected to count value CNTP[n:1]. Pass gate circuit 145 may provide alow impedance path between count values (CNT[n:1] and CNTP[n:1]) whenenabled and may provide a high impedance path between count values(CNT[n:1] and CNTP[n:1]) when disabled. Pass gate circuit 145 may bedisabled when test signal TEST1 and input enable signal INEN are bothlogic high levels and may be enabled otherwise. Test signal TEST1 andinput enable signal INEN may be received as inputs at pass gate controlterminals.

Count limit detector 150 may receive count value CNT[n:1] and mayprovide count limit signals (MAX and MIN) as outputs. Count limit signalMAX may transition from a logic low to a logic high level when countvalue CNT[n:1] has a maximum allowed value. Count limit signal MIN maytransition from a logic low to a logic high level when count valueCNT[n:1] has a minimum allowed value. Count limit signal MAX may disabletemperature sensor circuit 120 when at a logic high level. Count limitsignal MIN may disable temperature sensor circuit 130 when at a logichigh level. In this way, counter circuit 140 may be prevented fromrolling over from all zeroes to all ones and vice-versa.

Transition detector 160 can receive the least significant bit CNT[1]from count value CNT[n:1] and may provide a count transition signal CTD.Count transition signal CTD may be a pulse signal generated in responseto a logic transition in the least significant bit CNT[1] from countvalue CNT[n:1]. Count transition signal CTD may be provided totemporarily disable temperature sensor circuits (120 and 130). In thisway, glitches may be prevented when transitioning from a firsttemperature window to a second temperature window. Count transitionsignal CTD may also be provided to control circuit 180 such that readsignal READ and load signal LOAD may be generated to provide performanceparameters PP[m:1] to operational circuits 195, and respectively latchthe performance parameters to provide to performance parameter adjustedcircuits.

Performance parameter table 170 may receive count value CNT[n:1], a readsignal READ, and a program signal PROG as inputs and may provideperformance parameters PP[m:1] as an output. Performance parametersPP[m:1] may include m bits. Performance parameter table 170 may includea non-volatile memory array providing performance parameters PP[m:1] inaccordance to an address corresponding to the value of count valueCNTP[n:1] in response to read signal READ.

Control circuit 180 may receive a power up signal PUPD and counttransition signal CTD and may provide read signal READ and a load signalLOAD as outputs. Power up circuit 190 may provide power up signals (PUPand PUPD) as outputs in response to power being applied to semiconductordevice 100.

Operational circuits 195 may receive performance parameters PP[m:1],test signal TEST2, test performance parameters TPP[m:1], and load signalLOAD. Operational circuits 195 may latch performance parameters PP[m:1]into latches in response to load signal LOAD. The latched performanceparameters may modify the operation of circuitry, for example, increaseor decrease time delays, change the magnitude of potential levels,and/or vary threshold voltages in IGFETs, as just a few examples. Inthis way, circuitry in operational circuits 195 may operate over a largetemperature range without unduly wasting power or adversely affectingspeed at one temperature in order to provide functionality margin atanother temperature.

IN/OUT buffer circuit 196 may receive a test signal TEST1, input enablesignal INEN, and output enable signal OUTEN as an input and may receiveor provide count value CNTP[n:1] and data DATA[n:1] on bidirectionaldata lines. IN/OUT buffer circuit 196 may output data DATA[n:1] to datasignals DQ[n:1] when output enable signal OUTEN is enabled (logic high)and test signal TEST1 is disabled (logic low) and may output count valueCNTP[n:1] to data signals DQ[n:1] when output enable signal OUTEN isenabled (logic high) and test signal TEST1 is enabled (logic high).IN/OUT buffer circuit 196 may act as an input buffer to provide datasignals DQ[n:1] to bidirectional data lines DATA[n:1] when input enablesignal INEN is enabled (logic high) and test signal TEST1 is disabled(logic low) and may provide data signals DQ[n:1] to count valueCNTP[n:1] when input enable signal INEN is enabled (logic high) and testsignal TEST1 is enabled (logic high).

Counter circuit 198 may receive test count increment signal TCINC andtest count reset signal TCRST as inputs and may provide test performanceparameters TPP[m:1] as outputs. Counter circuit 198 may provide testperformance parameters during a test mode to optimize the operation ofoperational circuits in semiconductor device 100. Counter circuit 198may be reset in response to test count reset signal TCRST transitioningfrom a logic low to a logic high level. The value of test performanceparameters TPP[m:1] may be reset to have a value of “00 . . . 000” whenreset and may be incremented in response to the test count incrementsignal TCINC transitioning from a logic low to a logic high level.

Serial register 199 may receive a clock signal CLK and performanceparameter data PPD as inputs and may provide performance parametersPP[m:1] to be programmed into performance parameter table 170. Serialregister 199 may allow a tester to input performance parameter data PPDserially on a single input pin and write the performance parametersPP[m:1] into a row of memory in performance parameter table 170 asselected by count value CNTP[n:1] in response to a program signal PROG.

Referring now to FIG. 2, a diagram of temperature ranges set bytemperature sensor circuits (120 and 130) according to an embodiment isset forth. The diagram of FIG. 2 illustrates the temperature ranges thatcan correspond to each count value CNT[n:1]. Each temperature range (W1to W2 ^(n)), where n is the number of bits in count value CNT[n:1]), caninclude a temperature range upper limit value 204 (illustrated by asolid line) and an temperature range lower limit value 202 (illustratedby a dashed line). The temperature range upper limit value 204 may beset by the count value CNT[n:1] by a resistance value of a variableresistor (not shown) in temperature sensor circuit 120. The temperaturerange lower limit value 202 may be set by the count value CNT[n:1] by aresistance value of a variable resistor (not shown) in temperaturesensor circuit 130. It is noted that each temperature range (W1 to W2^(n)) can overlap with an adjacent temperature range (W1 to W2 ^(n)).For example, the temperature range upper limit value of temperaturerange W5 can overlap the temperature range lower limit value oftemperature range W6 and the temperature range lower limit value oftemperature range W5 can overlap the temperature range upper limit valueof temperature range W4. In other words, the temperature range upperlimit value 204 of temperature range W4 and the temperature range lowerlimit value 202 of temperature range W6 can both fall within temperaturerange W5.

Each respective value of count value CNT[n:1] can set resistance valuesof variable resistors so that the increment signal INC may transitionfrom a low logic level to a high logic level when the temperature of thesemiconductor device 100 transitions from within the set temperaturerange (W1 to W2 ^(n)) to the temperature range upper limit value and sothat the decrement signal DEC may transition from a low logic level to ahigh logic level when the temperature of the semiconductor device 100transitions from within the set temperature range (W1 to W2 ^(m)) to thetemperature range lower limit value.

Having a unique value for the count value CNT[n:1] allows performanceparameters PP[m:1] to be latched in latches included in operationalcircuits 195 as latched performance parameters and provided toperformance parameter adjusted circuits. In this way, performanceparameter adjusted circuits may functionally operate in each temperaturerange (W1 to W2 ^(n)) without the necessity of providing undue margin atone temperature of operation in order to satisfy another temperature ofoperation.

Temperature ranges (W1 to W2 ^(n)) may be conceptualized as temperaturewindows.

The operation of reference generator circuit 110, temperature sensorcircuits (120 and 130), counter circuit 140, count limit detector 150,transition detector 160, and control circuit 180 are described in detailin U.S. patent application Ser. Nos. 14/265,642, 14/265,653, 14/265,668,14/265,682, and 14/265,729, all filed Apr. 30, 2014 and all incorporatedherein by reference.

FIG. 3 is a test method for a semiconductor device according to anembodiment set forth in a flow diagram and given the general referencecharacter 300.

Test method 300 illustrates a test method for determining temperaturerange upper limit values 204 and temperature range lower limit values202 for temperature windows (W1 to W2 ^(n)).

FIG. 4 is a waveform diagram illustrating a test method for asemiconductor device according to an embodiment.

The waveform diagram of FIG. 4 includes waveforms of the temperatureTemperature, increment signal INC, count value CNT[5:1], data DQ[5:1],and test signal TEST1.

A portion of test method 300 will now be explained with reference toFIGS. 1 to 4.

An initial temperature may be set for semiconductor device 100 in a stepS302. The temperature value may be provided by a temperature chuck ifthe semiconductor device 100 is still integrally disposed on asemiconductor wafer, may be provided with a thermally conductivesubstance in direct contact with a heat spreader on a packagedsemiconductor device 100 or as a temperature in an oven, such as aburn-in oven in which the semiconductor device 100 is set within a testsocket, as just a few examples.

The initial temperature can be set at a low temperature 402 illustratedin FIG. 4. FIG. 4 sets forth waveforms for temperature TEMPERATURE,increment signal INC, count value CNT[5:1] (for counter 140 being a5-bit counter), data signal DQ[5:1], and test signal TEST1 In a stepS304, a test mode of operation may be entered. The test mode ofoperation may be entered by providing an overvoltage or undervoltage(e.g. a potential outside of specification) to an address pin ofsemiconductor device 100 in conjunction with a predetermined combinationof command signals, and/or address and data signals to semiconductordevice 100.

In response to entering the test mode of operation, test signal TEST1may transition from a logic low level to a logic high level. With testmode at a logic high level, IN/OUT buffer circuit 196 may provide countvalue CNT[5:1] as data signal DQ[5:1] when output enable signal OUTEN isin an enable state instead of data DATA[5:1] as in normal operation.When output signal OUTEN is in a disable state, IN/OUT buffer circuit196 may provide a high impedance state. It is noted that data signalDQ[5:1] is provided externally to/from semiconductor device 100 by wayof a pad, pin, solder bump, or the like, as just a few examples.

The value of low temperature 402 may be such that the temperature may beat or below the lower limit value 202 of temperature range W1.

With the temperature set at the low temperature 402, counter 140 mayprovide a count value CNT[5:1] being “00000”, which may be provided asdata signal DQ[5:1] by IN/OUT buffer circuit 196.

In a step S306, the value of data DQ[5:1] may be stored in memory of atest apparatus.

In a step S308 the temperature may be changed in a first direction (inthis case the temperature may be incrementally increased. Data DQ[5:1]may be monitored in step S310. In step S312, data signal DQ[5:1] may bechecked for a value change (for example, from “00000” to “00001”). Ifthe value of data DQ[5:1] has not changed then steps (S308 to S312) maybe repeated until the temperature reaches the temperature range upperlimit value (for example, temperature range upper limit value 204 oftemperature range W1 when count value CNT[5:1] has a value of “00000”).Eventually at time T1 (FIG. 4), temperature sensor circuit 120 maydetect a temperature range upper limit value and increment signal INCmay pulse high. Counter circuit 140 may increment in response toincrement signal INC to provide a count value CNT[5:1] of “00001”, whichmay be provided at data DQ[5:1] by way of input/output buffer circuit196. In this way, when the temperature has reached the temperature rangeupper limit value, counter circuit 140 may provide a count valueCNT[5:1] being “00001”, which may be provided at data DQ[5:1] by way ofinput/output buffer circuit 196. When data DQ[5:1] changes to “00001”,indicating the temperature range upper limit value 204 of temperaturerange W1 has been reached, the test method 300 may go to step S314 andthe temperature (corresponding to the temperature range upper limitvalue 204 of temperature range W1) may be stored in the memory of thetest apparatus.

At step S316, a determination may be made whether or not the data signalDQ[5:1] (count value CNT[5:1]) is at a limit (in this case, a maximumlimit of “11111”). Because the data DQ[5:1] is at a value of “00001”,the test method 300 may return to step S308 and steps (S308 to S316) maybe repeated as described above until all the temperature range upperlimit values 204 of temperature ranges (W1 to W2 ^(n)−1) have beenstored in the memory of the test apparatus. At this time T2 (FIG. 4),data DQ[5:1] may have a value of “11111” and the test method 300 mayproceed to step S318.

FIG. 5 is a waveform diagram illustrating a test method for asemiconductor device according to an embodiment.

A portion of test method 300 will now be explained with reference toFIGS. 1, 2, 3, and 5.

The waveform diagram of FIG. 5 includes waveforms of the temperatureTemperature, decrement signal DEC, count value CNT[5:1], data DQ[5:1],and test signal TEST1.

At step S318, the temperature of the semiconductor device 100 mayessentially be at the temperature range upper limit value of temperaturerange W2 ^(n)−1. Data DQ[5:1] having a value of “11111” may be stored atthis time. At a step S320, the temperature may be incrementally changedin a second direction (incrementally decreased). Data DQ[5:1] may bemonitored at step S322. At step S324, a determination may be made as towhether the value of data DQ[5:1] has changed (through counter circuit140 decrementing). If data DQ[5:1] has not changed, steps (S320 andS322) may be repeated. Eventually at time T1 (FIG. 5), temperaturesensor circuit 130 may detect a temperature range lower limit value anddecrement signal DEC may pulse high. Counter circuit 140 may decrementin response to decrement signal DEC to provide a count value CNT[5:1] of“11110”, which may be provided at data DQ[5:1] by way of input/outputbuffer circuit 196. When data DQ[5:1] changes to “11110”, indicating thetemperature range lower limit value 202 of temperature range W2 ^(n) hasbeen reached, the test method 300 may go to step S326 and thetemperature (corresponding to the temperature range lower limit value202 of temperature range W2 ^(n)) may be stored in the memory of thetest apparatus.

At step S328, a determination may be made whether or not the data signalDQ[5:1] (count value CNT[5:1]) is at a limit (in this case, a minimumlimit of “00000”). Because the data DQ[5:1] is at a value of “11110”,the test method 300 may return to step S318 and steps (S318 to S328) maybe repeated as described above until all the temperature range lowerlimit values 202 of temperature ranges (W2 ^(n) to W1) have been storedin the memory of the test apparatus. At this time T2 (FIG. 5), dataDQ[5:1] may have a value of “00000” and the test method 300 may proceedto step S330. At this time all the temperature range upper limit values204 and temperature range lower limit values 202 may be stored in thememory of a test apparatus for each temperature range (W1 to W2 ^(n)).

Referring now to FIG. 6, a block schematic diagram illustrating a testapparatus that can test a semiconductor device according to anembodiment is set forth and given the general reference character 600.The test apparatus 600 can include a test control apparatus 602, athermal source 604, and a device under test 606. Device under test 606may be semiconductor device 100 of FIG. 1. Test apparatus may be used toperform the test method 300 illustrated in FIG. 3.

Test control apparatus 602 can provide temperature control signals HCTLon a bus received by thermal source 604. Test control apparatus 602 mayalso provide control signals CNTRL to the device under test 606. Controlsignals CNTRL may include address signals, command signals, and/or datasignals or the like for operating device under test 606. Test controlapparatus 602 may also provide and/or receive data DQ[n:1]. Thermalsource 604 may provide a predetermined temperature value to device undertest 604 in response to temperature control signals HCTL. Device undertest 606 may receive control signals CNTRL from test control apparatus602 and may provide and/or receive data DQ[n:1].

Referring now to FIG. 7, a schematic diagram illustrating a thermalsource and a device under test according to an embodiment is set forthand given the general reference character 700.

The schematic diagram of FIG. 7 can include a device under test 710 anda thermal source 720. The device under test 710 can be a packagedsemiconductor device, such as semiconductor device 100 of FIG. 1.Thermal source 720 can be thermal source 604 of FIG. 6.

Device under test 710 can include a semiconductor integrated circuit712, encapsulation material 714, contact bumps 716, and a heat spreader718. Heat spreader 718 may be in thermal contact with thermal source 720and semiconductor integrated circuit 712.

Thermal source 720 may include thermal controller 722 and thermallyconductive metal 724. Thermal controller 722 may provide a predeterminedtemperature value to thermally conductive metal 724 in response totemperature control signals HTCL provided from test control apparatus602.

In this way, a test apparatus may provide a predetermined temperature toa semiconductor integrated circuit 712 by providing the predeterminedtemperature to a thermally conductive metal 724 in direct contact with aheat spreader 718 that is in contact with a semiconductor integratedcircuit 712 and a thermal test method may be performed.

Referring now to FIG. 8, a table stored in test control apparatusaccording to an embodiment is set forth. The table of FIG. 8, caninclude a column x showing the number of temperature ranges or windows.Column x can include digits 1 to 2^(n), for a counter 140 having n-bits.X can be conceptualized as a pointer. A temperature window or rangecolumn Temp Window can have temperature windows or ranges (W1 to W2^(n)). A column CNT[n:1] can have count values (00 . . . 0000 to 11 . .. 111), each count value can correspond to a respective temperaturewindow or range (W1 to W2 ^(n)). A temperature window upper limit valuecolumn Tmax may include values (T1max to T2 ^(n)max) for temperaturerange upper limit values 204 for each respective temperature window orrange (W1 to W2 ^(n)) as determined in test method 300. A temperaturewindow lower limit value column Tmin may include values (T1min to T2^(n)min) for temperature range lower limit values 202 for eachrespective temperature window or range (W1 to W2 ^(n)) as determined intest method 300. A temperature window midpoint value column Tmid mayinclude values (Timid to T2 ^(n)mid) for temperature range midpointvalues for each respective temperature window or range (W1 to W2 ^(n)).The temperature range midpoint values may be essentially an average of atemperature range upper limit value 204 and a temperature range lowerlimit value 202 for a respective temperature window or range (W1 to W2^(n)).

A semiconductor device 100 may be optimized for speed performance or lowpower consumption depending on the desired application by a vendor. Forexample, a mobile device manufacturer may desire semiconductor device100 to operate using as little power as feasible while meeting minimumspeed specifications and a high performance computer manufacturer maydesire semiconductor device 100 to operate as fast as feasible whilemeeting maximum power specifications.

In FIG. 9, a method of optimizing speed performance over a wide range oftemperatures is set forth in a flow diagram and given the generalreference character 900.

FIG. 10, is a timing diagram illustrating a portion of a test method fortesting a semiconductor device, such as semiconductor device 100.

The timing diagram of FIG. 10 includes a temperature value Temperature,test count reset signal TCRST, test count increment signal TCINC,performance parameters PP[5:1] (for a 5-bit performance parameter, as anexample, m=5), and a test signal TEST2.

Referring now to FIG. 9 in conjunction with FIG. 10.

Initially, tester 602 may provide control signals CNTRL for device undertest 606 to enter a test mode in which test signal TEST2 may be set to alogic high level.

Method 900 may include a step 902 in which a timing may be set at avalue Tmin, which is a minimum value according to a desiredspecification. In a step 904, a pointer x may be set to x=1. In a step906 the temperature of thermal source 604 can be set to a temperaturerange midpoint value T1mid (because x=1, Temp=T(x)mid=T1mid).

In a step 908, the test performance parameters TPP[5:1] may be set toall zeroes (“00000”). This may be accomplished as illustrated in FIG. 10at time T1 in response to a test counter reset signal TCRST pulse. Inthis way, counter 198 (FIG. 1) may provide test performance parametersTPP[5:1]=00000.

In a step 910 various current values may be checked to see if they arebelow a maximum specification. Current values may be active currentvalues, standby current values, and sleep current values, as just a fewexamples. A sleep current value may be when semiconductor device isplaced in a sleep mode in which a plurality of input buffers may beturned off, and signals may be internally generated to minimally satisfybasic functionality, for example, an internal refresh clock in a DRAM.If the various current values are below a maximum specification, thenmethod 900 goes to a step 912, otherwise, the method 900 goes to a step920.

If the current values are below a maximum specification, the method goesto a step 912. In step 912, speed performance is tested. If the speedtiming Time is below Tmin, then the new minimum timing Tmin may be setto the speed timing Time, otherwise the method 900 goes to a step 920.It is understood that the timing tested can be various timings and thatall timings must be below maximum specifications, however, the timingTime (timing parameter) that is optimized may be an access time or acombination of read and write timing, for example, the summation of theread and write timings, or a clock period time for a synchronouslyoperated device, such as a synchronous memory or a processor, as justtwo examples.

In a step 916, test performance parameters TPP[5:1], may be stored asoptimal test performance parameters PPOPT[5:1]. Next, the method 900goes to a step 920.

In step 920, test performance parameters TPP[5:1] are checked to see ifthey have a value of “11111”. If they do not, then increment signalTCINC (time T2 of FIG. 10) may be pulsed high in a step 918. In thisway, counter 198 may increment test performance parameters TPP[5:1] andtest performance parameters TPP[5:1] may have a value of “00001”.

Steps (910 to 920) may be repeated until step 920 detects testperformance parameters TPP[5:1] having a value of “11111” (time T3 ofFIG. 10). In response to test performance parameters TPP[5:1] having avalue of “11111”, the method 900 goes to a step 922.

In step 922, optimal test performance parameters PPOPT[5:1] may bestored in a memory location within tester 602 based on the value of x(in this case x=1) indicating the temperature window Wx in this casetemperature window W1.

In step 924, x is checked to see if it is a maximum value (i.e. the lasttemperature window W2 ^(n)). If x is not at a maximum value, the method900 goes to a step 926.

In step 926, x is incremented by 1 and the method 900 returns to step906 and the temperature is set to the next temperature range midpointvalue Timid. Steps (906 to 926) are repeated until step 924 detects x ata maximum value (2^(n)) and the method 900 goes to step 928.

In a step 928, the stored optimal test performance parameters PPOPT[5:1]are written into performance parameter table 170, where each temperaturerange (window) (W1 to W2 ^(n)) may have values based on the storedoptimal test performance parameters PPOPT[5:1] determined by method 900for each tested temperature range midpoint value Tmid in the table ofFIG. 8. Referring to FIG. 10 in conjunction with FIG. 9, steps (910 to916) may be performed between time T1 and T2 (shown as test TST). Steps(908 to 926) may be performed between time T1 and T3 for settingperformance parameters for a temperature range (W1 to W2 ^(n)) inaccordance with the test performed at a temperature range midpoint value(Timid to T2 ^(n)mid).

Referring now to FIG. 11, a timing diagram illustrating writingperformance parameters to a performance parameter table according to anembodiment is set forth. FIG. 11 illustrates step 928 of method 900 ofFIG. 9 in which stored optimal test performance parameters are writteninto performance parameter table 170.

The timing diagram of FIG. 11 includes a program signal PROG, a clocksignal CLK, performance parameter data PPD, performance parametersPP[m:1], data DQ[5:1], input enable signal INEN, count value CNTP[5:1],and test signal TEST1.

At time T1, performance parameter data PPD may be synchronously shiftedinto serial register 199 in response to clock signal CLK. Theperformance parameter data PPD may be optimal test performanceparameters corresponding to temperature range W1 serially provided in mclock cycles. Serial register 199 may convert the serially appliedperformance parameter data into a parallel applied performanceparameters PP[m:1].

Data DQ[5:1] may receive a value of “00000” (in this case counter 140provides a 5-bit count output). With input enable signal INEN having ahigh logic level, input/output buffer circuit 196 may provide countvalue CNTP[5:1] having a value of “00000”. Note, at this time testsignal TEST1 and input enable signal INEN are both logic high levels sothat pass gate circuit 145 is in a high impedance state preventingcounter circuit 140 from providing count value CNTP[5:1]. At time T2,program signal PROG may pulse high and performance parameters PP[m:1]may be written into a row of non-volatile memory cells selected by countvalue CNTP[5:1] in performance parameter table 170. In this wayperformance parameters for temperature range W1 may be written intoperformance parameter table 170. This operation may be repeated for eachcorresponding temperature range (W1 to W32, as n=5) until at time T3 inwhich performance parameters for temperature window W32 is written intoperformance parameter table 170.

Referring now to FIG. 12, a method of optimizing power consumption overa wide range of temperatures is set forth in a flow diagram and giventhe general reference character 1200.

Referring now to FIG. 12 in conjunction with FIG. 10.

Initially, tester 602 may provide control signals CNTRL for device undertest 606 to enter a test mode in which test signal TEST2 may be set to alogic high level.

Method 1200 may include a step 1202 in which a current (such as anaverage current) may be set at a value Imin, which is a maximum valueacceptable according to a desired specification. In a step 1204, apointer x may be set to x=1. In a step 1206 the temperature of thermalsource 604 can be set to a temperature range midpoint value T1mid(because x=1, Temp=T(x)mid=T1mid). Current values may be active currentvalues, standby current values, and sleep current values, as just a fewexamples. A sleep current value may be when semiconductor device isplaced in a sleep mode in which a plurality of input buffers may beturned off, and signals may be internally generated to minimally satisfybasic functionality, for example, an internal refresh clock in a DRAM.

In a step 1208, the test performance parameters TPP[5:1] may be set toall zeroes (“00000”). This may be accomplished as illustrated in FIG. 10at time T1 in response to a test counter reset signal TCRST pulse. Inthis way, counter 198 (FIG. 1) may provide test performance parametersTPP[5:1]=00000.

In a step 1210 various timing values may be checked to see if they arebelow a maximum specification. If the various timing values are below amaximum specification, then method 1200 goes to a step 1212, otherwise,the method 1200 goes to a step 1220.

If the timing values are below a maximum specification, the method goesto a step 1212. In step 1212, current/power performance is tested. Ifthe current I is below Imin, then the new minimum current value Imin maybe set to the test sampled current I at step 1214, otherwise the method1200 goes to a step 1220. It is understood that the current tested canbe various currents and that all currents must be below maximumspecifications, however, the current I (current parameter) that isoptimized may be an average active current, active standby current, or acombination of active and standby currents, for example, the summationof the active and standby currents.

In a step 1216, test performance parameters TPP[5:1], may be stored asoptimal test performance parameters PPOPT[5:1]. Next, the method 1200goes to a step 1220.

In step 1220, test performance parameters TPP[5:1] are checked to see ifthey have a value of “11111”. If they do not, then increment signalTCINC (time T2 of FIG. 10) may be pulsed high in a step 1218. In thisway, counter 198 may increment test performance parameters TPP[5:1] andtest performance parameters TPP[5:1] may have a value of “00001”. Steps(1210 to 1220) may be repeated until step 1220 detects test performanceparameters TPP[5:1] having a value of “11111”. In response to testperformance parameters TPP[5:1] having a value of “11111”, the method1200 goes to a step 1222.

In step 1222, optimal test performance parameters PPOPT[5:1] may bestored in a memory location within tester 602 based on the value of x(in this case x=1) indicating the temperature window Wx in this casetemperature window W1.

In step 1224, x is checked to see if it is a maximum value (i.e. thelast temperature window W2 ^(n)). If x is not at a maximum value, themethod 1200 goes to a step 1226.

In step 1226, x is incremented by 1 and the method 1200 returns to step1206 and the temperature is set to the next temperature range midpointvalue T2mid. Steps (1206 to 1226) are repeated until step 1224 detects xat a maximum value (2^(n)) and the method 1200 goes to step 1228. In astep 1228, the stored optimal test performance parameters PPOPT[5:1] arewritten into performance parameter table 170, where each temperaturerange (window) (W1 to W2 ^(n)) may have values based on the storedoptimal test performance parameters PPOPT[5:1] determined by method 1200for each tested temperature range midpoint value Tmid in the table ofFIG. 8. Step 1228 follows the same writing method as illustrated in FIG.11 and explained above with step 928 of FIG. 9.

Referring to FIG. 10 in conjunction with FIG. 12, steps (1210 to 1216)may be performed between time T1 and T2 (shown as test TST). Steps (1208to 1226) may be performed between time T1 and T3 for setting performanceparameters for a temperature range (W1 to W2 ^(n)) in accordance withthe test performed at a temperature range midpoint value (Timid to T2^(n)mid).

Referring now to FIG. 13, a semiconductor wafer including a plurality ofsemiconductor devices according to an embodiment is set forth in aschematic diagram and given the general reference character 1300. FIG.13 is a top plan view of semiconductor wafer 1300.

Semiconductor wafer 1300 can include semiconductor devices 1302 formedintegrally on a top surface. Semiconductor devices 1302 can be formed inbatch and under similar and generally during the same process steps. Inthis way, operating characteristics all known good die (semiconductordevices 1302 without defects) of each semiconductor device 1302 onsemiconductor wafer may be substantially similar. A semiconductor wafer1300 may be very large, 12 inches or more in diameter. Thus, there canbe substantial distances between semiconductor devices 1302 on oppositeedges of semiconductor wafer 1300. Such difference can produce someprocess variations. Semiconductor devices 1302 may have the sameconstituents as semiconductor device 100.

Referring now to FIG. 14, a block schematic diagram illustrating a testapparatus that can test a semiconductor device on a semiconductor waferaccording to an embodiment is set forth and given the general referencecharacter 1400. The test apparatus 1400 can include a test controlapparatus 1412, a probe card 1414, and a chuck 1420. Test apparatus 1400may be used to perform the test methods (300, 900, and 1200) illustratedin FIGS. 3, 9, and 12, respectively.

Test control apparatus 1412 can provide temperature control signals HCTLon a bus received by chuck 1420. Test control apparatus 1412 may alsoprovide control signals CNTRL to probe card 1414. Test control apparatus1412 may also provide and/or receive data DQ[n:1] to probe card 1414.

Probe card 1414 may provide an electrical contact between test controlapparatus 1412 and a semiconductor device under test formed onsemiconductor wafer 1300.

Control signals CNTRL may include address signals, command signals,clock signals, and/or data signals or the like for operating asemiconductor device under test on semiconductor wafer 1300. Chuck 1420may provide a predetermined temperature value to semiconductor device1300 in response to temperature control signals HCTL. A semiconductordevice under test formed integrally on semiconductor wafer 1300 mayreceive control signals CNTRL from test control apparatus 1412 (viaprobe card 1414) and may provide and/or receive data DQ[n:1] (via probecard 1414).

Referring now to FIG. 13 in conjunction with FIG. 14, semiconductorwafer 1300 may include regions (1310, 1320, 1330, and 1340). Each region(1310, 1320, 1330, and 1340) may respectively include a semiconductordevice (1312, 1322, 1332, and 1342) to be tested by test apparatus 1400a test method (such as test methods (300, 900, and 1200) so thatregional performance parameters for temperature ranges (W1 to W2 ^(n))may be determined.

At a later step, regional performance parameters for temperature ranges(W1 to W2 ^(n)) for each respective region (1310, 1320, 1330, and 1340)may then be programmed into performance parameter tables 170 for eachsemiconductor device 1302 within the respective region (1310, 1320,1330, and 1340).

Referring now to FIG. 15, a method of testing and programmingsemiconductor devices on a semiconductor wafer according to anembodiment is set forth in a flow diagram and given the generalreference character 1500.

Method 1500 will now be explained with reference to FIG. 15 inconjunction with FIGS. 13 and 14.

In a step 1502, the number of regions (1310, 1320, 1330, and 1340) insemiconductor wafer 1300 may be determined, for example k regions.

In a step 1504, a variable x may be set to 1, thereby identifying thefirst region (for example, region 1310) is to be tested.

In a step 1506, semiconductor device 1312 for region x (i.e. the firstregion as x=1) is tested. In step 1506, methods (300, 900, and/or 1200)may be followed in the test and a test apparatus 1400 may be used toperform the above-mentioned test.

In a step 1508, it is determined if x=k. If x<k, the method 1500proceeds to step 1510. In step 1510, x is incremented (x=x+1) and themethod 1500 returns to step 1506. The method continues in this loopuntil a predetermined semiconductor device (1312, 1322, 1332, and 1342),respectively in each region (1310, 1320, 1330, and 1340) insemiconductor wafer 1300 has been tested to determine regionally basedperformance parameters for temperature ranges (W1 to W2 ^(n)).

When a predetermined semiconductor device (1312, 1322, 1332, and 1342),respectively, in each region (1310, 1320, 1330, and 1340) insemiconductor wafer 1300 has been tested, x=k in step 1508, so themethod 1500 proceeds to step 1512.

At step 1512, the semiconductor wafer 1300 may be diced (by saw, laser,or the like) and semiconductor devices 1302 may be packaged.

Next, at a step 1514, the packaged semiconductor devices may beseparated into bins based on region (1310, 1320, 1330, and 1340) fromthe semiconductor wafer 1300 each device 1302 originated.

Next at a step 1516, each packaged semiconductor device is programmedwith respective regional performance parameters (determined at step1506) in accordance with the bin identification.

Next, at step 1518 the method 1500 may end.

In the method 1500, only predetermined semiconductor devices (1312,1322, 1332, and 1342) may be tested over temperature ranges (W1 to W2^(n)) to determine regional based performance parameters for eachtemperature range (W1 to W2 ^(n)). All other semiconductor devices 1302may then be programmed with the regional based performance parameters ata later step (for example, after packaging). In this way, time may besaved by eliminating the need to test each semiconductor device 1302.Furthermore, the need to use an invasive probe (from probe card 1414) oneach semiconductor device 1302 may be eliminated. Furthermore, bydetermining performance parameters over temperature ranges (W1 to W2^(n)) on a semiconductor wafer 1300, a chuck 1420 that can provide awide range of temperatures in direct contact with a large number ofsemiconductor devices 1302 can reduce the need to repeatedly provide thetemperatures for each individual semiconductor device 1302 separately.

Referring now to FIG. 16, a method of testing and programmingsemiconductor devices on a semiconductor wafer according to anembodiment is set forth in a flow diagram and given the generalreference character 1600.

Method 1600 may include steps (1602, 1604, 1606, 1608, and 1610) thatmay be substantially the same as steps (1502, 1504, 1506, 1508, and1510), respectively, of method 1500 and therefore the detaileddescription may be omitted.

Method 1600 may differ from method 1600 in when a predeterminedsemiconductor device (1312, 1322, 1332, and 1342), respectively, in eachregion (1310, 1320, 1330, and 1340) in semiconductor wafer 1300 has beentested, x=k in step 1608, the method 1600 proceeds to step 1612 in whicheach semiconductor device 1302 is programmed with respective regionalperformance parameters (determined at step 1506) while still onsemiconductor wafer 1300.

Method 1600 then proceeds to step 1614 in which semiconductor wafer 1300may be diced (by saw, laser, or the like) and semiconductor devices 1302may be packaged.

Method 1600 then ends at step 1616.

Referring now to FIG. 17, an example of operational circuits accordingto an embodiment are set forth in a block schematic diagram and giventhe general reference character 1700. Operational circuits 1700 can beoperational circuits 195 in semiconductor device 100 of FIG. 1.Operational circuits 1700 can include registers 1710 and performanceparameter adjusted (adjustable) circuits 1720. Performance parameteradjusted circuits 1720 may have operational aspects adjusted inaccordance with latched performance parameters PPL[m:1] latched intoregisters 1710.

Registers 1710 may receive performance parameters PP[m:1], load signalLOAD, test performance parameters TPP[m:1], and test signal TEST2 asinputs and may provide latched performance parameters PPL[m:1] asoutputs. Performance parameter adjusted circuits 1720 may receivelatched performance parameters PPL[m:1].

When test signal TEST2 is at a logic high (i.e. enabled), registers 1710may pass test performance parameters TPP[m:1] as latched performanceparameters PPL[m:1]. When test signal is logic low (i.e. disabled), thenregisters 1710 may latch the performance parameters PP[m:1] to providelatched performance parameters PPL[m:1].

Performance parameter adjusted circuits 1720 may be used in asemiconductor device (such as semiconductor device 100) that havesub-threshold voltage operating circuits and above sub-threshold voltageoperating circuits. A sub-threshold voltage operating circuit is acircuit that operates at a power supply potential level below thethreshold voltages of the included transistors (i.e. IGFETs). An abovesub-threshold voltage operating circuit is a circuit that operates at apower supply potential level above the threshold voltages of theincluded transistors (i.e. IGFETs).

Performance parameter adjusted circuits 1720 can include abovesub-threshold voltage operating circuits 1730, sub-threshold voltageoperating circuits 1740, power supply generating circuits (1732 and1742), and back bias voltage generating circuits (1734, 1736, 1744, and1746).

Above sub-threshold voltage operating circuits 1730 can include circuitsthat are configured of p-channel IGFETs PNM and n-channel IGFETs NNM.P-channel IGFETs PNM may receive a back body bias Vbp1 and n-channelIGFETs NNM may receive a back body bias Vbn1. The circuits in abovesub-threshold voltage operating circuits 1730 may receive a power supplyVDD1.

Sub-threshold voltage operating circuits 1740 can include circuits thatare configured of p-channel IGFETs PSUB and n-channel IGFETs NSUB.P-channel IGFETs PSUB may receive a back body bias Vbp2 and n-channelIGFETs NSUB may receive a back body bias Vbn2. The circuits in abovesub-threshold voltage operating circuits 1740 may receive a power supplyVDD2.

Each of power supply generating circuits (1732 and 1742), and back biasvoltage generating circuits (1734, 1736, 1744, and 1746) may receive aunique plurality (subset) of latched performance parameters (PPL[m:1])as inputs and may adjust the potentials of their outputs in responsethereto.

Power supply generating circuit 1732 may receive a plurality of latchperformance parameters (PPL[m:1]) as inputs and may provide a powersupply VDD1 as an output. Power supply VDD1 may be used as a powersupply for above sub-threshold voltage operating circuits 1730. In thisway, the potential of power supply VDD1 may vary in response to atemperature range in which the semiconductor device is operating.

Back bias voltage generating circuit 1734 may receive a plurality oflatch performance parameters (PPL[m:1]) as inputs and may provide a backbody bias Vbp1 as an output. Back body bias Vbp1 may be used as backbody bias for p-channel IGFETs PNM in above sub-threshold voltageoperating circuits 1730. In this way, the potential of back body biasVbp1 may vary in response to a temperature range in which thesemiconductor device is operating.

Back bias voltage generating circuit 1736 may receive a plurality oflatch performance parameters (PPL[m:1]) as inputs and may provide a backbody bias Vbn1 as an output. Back body bias Vbn1 may be used as backbody bias for n-channel IGFETs NNM in above sub-threshold voltageoperating circuits 1730. In this way, the potential of back body biasVbn1 may vary in response to a temperature range in which thesemiconductor device is operating.

Power supply generating circuit 1742 may receive a plurality of latchperformance parameters (PPL[m:1]) as inputs and may provide a powersupply VDD2 as an output. Power supply VDD2 may be used as a powersupply for sub-threshold voltage operating circuits 1740. In this way,the potential of power supply VDD2 may vary in response to a temperaturerange in which the semiconductor device is operating.

Back bias voltage generating circuit 1744 may receive a plurality oflatch performance parameters (PPL[m:1]) as inputs and may provide a backbody bias Vbp2 as an output. Back body bias Vbp2 may be used as backbody bias for p-channel IGFETs PSUB in sub-threshold voltage operatingcircuits 1740. In this way, the potential of back body bias Vbp2 mayvary in response to a temperature range in which the semiconductordevice is operating.

Back bias voltage generating circuit 1746 may receive a plurality oflatch performance parameters (PPL[m:1]) as inputs and may provide a backbody bias Vbn2 as an output. Back body bias Vbn2 may be used as backbody bias for n-channel IGFETs NSUB in sub-threshold voltage operatingcircuits 1740. In this way, the potential of back body bias Vbn2 mayvary in response to a temperature range in which the semiconductordevice is operating.

As described above, performance parameter adjusted circuits 1720 in asemiconductor device 100 may have tight control over back body biases(Vbp1, Vbn1, Vbp2, and Vbn2) and power supply voltages (VDD1 and VDD2)to control threshold voltages and power supply voltages of operationalcircuits for both above sub-threshold voltage operating circuits 1730and sub-threshold operating circuits 1740 in a plurality of temperatureranges (such as temperature ranges (W1 to Wr shown in FIG. 2) so thatspeed and/or power consumption may be improved without designing formargins at extreme corners.

During the test mode of operation, such as performed in test methods(900, 1200, and 1600), test signal TEST2 may be at a logic high whenoptimizing performance parameters.

Referring now to FIG. 18, a register circuit 1800 according to anembodiment is set forth in a circuit schematic diagram.

There may be “m” register circuits 1800 comprising registers 1710 inoperational circuit 195.

Each register circuit 1800 may receive a predetermined one ofperformance parameters PP[m:1], load signal LOAD, a predetermined one oftest performance parameters TPP[m:1], test signal TEST2, and power upsignal PUP at input terminals and may provide a corresponding latchedperformance parameter PPL[m:1] at an output terminal.

Each register circuit 1800 may include a register portion 1810 and amultiplexer circuit 1820.

Register portion 1810 may receive a predetermined one of performanceparameters PP[m:1], load signal LOAD, and power up signal PUP at inputterminals and may provide a corresponding latched output at a terminal1804. Multiplexer circuit 1810 may receive the latched output fromregister portion 1810, a predetermined one of test performanceparameters TPP[m:1], and test signal TEST2 as inputs and may provide acorresponding latched performance parameter PPL[m:1] at an outputterminal.

Each register portion 1810 may include inverters (INV1802, INV1804, andINV1806), a pass gate PG1802, and an N-channel IGFET N1802.

Pass gate PG1802 may receive one of performance parameters PP[m:1] aninput terminal 1802 at an input terminal and a load signal LOAD at acontrol input and may provide an output to an input of inverter INV1804.Inverter INV1802 may receive load signal LOAD and may provide an outputto another control input terminal of pass gate PG1802. N-channel IGFETN1802 may have a source connected to ground, a drain connected to theinput of inverter INV1804, and a gate connected to receive a power upsignal PUP. Inverter INV1804 may provide a latched output to terminal1804. Inverter INV1806 may have an input connected to terminal 1804 andan output connected to the input of inverter INV1804 to form a latch.

Multiplexer circuit 1820 may include pass gates (PG1822 and PG1824) andinverter INV1822.

Inverter INV1822 may receive test signal TEST2 as an input at an inputterminal and may provide an output at an output terminal.

Pass gate PG1822 may receive the latched output at terminal 1804 fromlatch portion 1810 at an input terminal, test signal TEST2 at ap-channel control input, and the output of inverter INV1822 at an-channel control input, and may provide a corresponding latchedperformance parameter PPL[m:1] at an output terminal.

Pass gate PG1824 may receive a predetermined one of test performanceparameters TPP[m:1] at an input terminal, test signal TEST2 at an-channel control input, and the output of inverter INV1822 at ap-channel control input, and may provide a corresponding latchedperformance parameter PPL[m:1] at an output terminal.

When test signal TEST2 is at a logic high (i.e. enabled), pass gatePG1824 may be turned on and a low impedance path may be provided betweena predetermined one of test performance parameters TPP[m:1] and theoutput terminal to pass the predetermined one of test performanceparameters TPP[m:1] as latched performance parameter PPL[m:1]. When testsignal TEST2 is at a logic high, pass gate PH1822 is turned off toprovide a high impedance path between terminal 1804 and the outputterminal.

When test signal TEST2 is at a logic low (i.e. disabled), pass gatePG1822 may be turned on and a low impedance path may be provided betweenthe latched output at terminal 1804 and the output terminal to pass thelatched output at terminal 1804 as latched performance parameterPPL[m:1]. When test signal TEST2 is at a logic low, pass gate PH1824 isturned off to provide a high impedance path between the predeterminedone of test performance parameters TPP[m:1] and the output terminal.

In this way, when test signal TEST2 is at a logic high (i.e. enabled),register circuit 1800 may pass test performance parameters TPP[m:1] aslatched performance parameters PPL[m:1]. When test signal is logic low(i.e. disabled), then register circuit 1800 may latch the performanceparameters PP[m:1] (in response to load signal LOAD) to provide latchedperformance parameters PPL[m:1].

Referring now to FIG. 19, an input/output buffer circuit and pass gatecircuit according to an embodiment are set forth in a circuit schematicdiagram and given the general reference character 1900. Input/outputbuffer circuit and pass gate circuit 1900 can represent one of ninput/output buffer circuit 196 and pass gate circuits 145 insemiconductor device of FIG. 1.

Input/output buffer circuit and pass gate circuit 1900 can include apass gate circuit 1910 and an input/output buffer circuit 1920.

Pass gate circuit 1910 can receive count value CNT[n:1] at an inputterminal and may have an output terminal connected to provide countvalue CNTP[n:1]. Input/output buffer circuit 1920 may receive testsignal TEST1, input enable signal INEN, and output enable signal OUTENat input terminals. Input/output buffer circuit 1920 may receive and/orprovide count value CNT[n:1], data DATA[n:1], and data signals DQ[n:1]at respective terminals (bidirectional terminals).

Pass gate circuit 1910 can include logic gate circuit G1910, invertercircuit INV1910, and a pass gate PG1910. Logic gate circuit G1910 can bea NAND logic gate. Logic gate circuit G1910 can receive test signalTEST1 and input enable signal INEN at respective input terminals and mayprovide an output. Inverter INV1910 may receive the output of logic gatecircuit G1910 at an input terminal and may provide an output. Pass gatePG1910 may be a pass gate including complementary IGFETS (a p-channelIGFET and an n-channel IGFET) having source/drain terminals connected inparallel between terminals providing count values (CNT[n:1] andCNT[p:1]). The n-channel IGFET may receive the output of logic gateG1910 at a gate terminal and the p-channel IGFET may receive the outputof inverter INV1910 at a gate terminal. In this way, pass gate PG1910may provide a low impedance path between count values (CNT[n:1] andCNT[p:1]) when either test signal TEST1 or input enable signal INEN areat a logic low (disabled) and a high impedance path between count values(CNT[n:1] and CNT[p:1]) when test signal TEST1 and input enable signalINEN are both at a logic high (enabled).

Input/output buffer circuit 1920 can include a multiplexer circuit 1930and a buffer circuit 1940. Multiplexer circuit 1930 can receive testsignal TEST1 as an input and may electrically connect either dataDATA[n:1] or count value COUNT[n:1] to a terminal 1932 in response totest signal TEST1 Buffer circuit 1920 may provide a bidirectional pathbetween data signal DQ[n:1] and terminal 1932 in accordance with thelogic levels of input enable signal INEN and output enable signal OUTEN.When input enable signal INEN is at a logic high, buffer circuit 1940may pass data signal DQ[n:1] to terminal 1932. When output enable signalOUTEN is at a logic high, buffer circuit 1940 may pass a signal atterminal 1932 to data signal DQ[n:1].

Multiplexer circuit 1930 can include pass gates (PG1932 and PG1934) andan inverter INV1932.

Inverter INV1932 may receive test signal TEST1 at an input terminal andmay provide an output at an output terminal. Pass gates (PG1932 andPG1934) may each include complementary IGFETS (a p-channel IGFET and ann-channel IGFET) having source/drain terminals connected in parallel.Pass gate PG1932 may receive test signal TEST1 at a p-channel IGFETcontrol (gate) terminal and may receive the output of inverter INV1932at an re-channel IGFET control (gate) terminal. In this way, pass gatePG1932 may provide a low impedance path between data DATA[n:1] andterminal 1932 when test signal TEST1 is at a logic low level (disabled)and a may provide a high impedance path between data DATA[n:1] andterminal 1932 when test signal TEST1 is at a logic high level (enabled).Pass gate PG1934 may receive test signal TEST1 at an n-channel IGFETcontrol (gate) terminal and may receive the output of inverter INV1932at a p-channel IGFET control (gate) terminal. In this way, pass gatePG1934 may provide a high impedance path between count value CNTP[n:1]and terminal 1932 when test signal TEST1 is at a logic low level(disabled) and a may provide a low impedance path between count valueCNTP[n:1] and terminal 1932 when test signal TEST1 is at a logic highlevel (enabled).

Referring now to FIG. 20, another example of operational circuits 195are set forth in a block schematic diagram. Operational circuits caninclude registers 2010 and performance parameter adjusted (adjustable)circuits 2020. Performance parameter adjusted circuits 2020 may haveoperational aspects adjusted in accordance with latched performanceparameters PPL[m:1] latched into registers 2020.

Registers 2010 may receive performance parameters PP[m:1], load signalLOAD, test performance parameters TPP[m:1], and test signal TEST2 asinputs and may provide latched performance parameters PPL[m:1] asoutputs. Performance parameter adjusted circuits 2020 may receivelatched performance parameters PPL[m:1].

When test signal TEST2 is at a logic high (i.e. enabled), registers 2010may pass test performance parameters TPP[m:1] as latched performanceparameters PPL[m:1]. When test signal is logic low (i.e. disabled), thenregisters 2010 may latch the performance parameters PP[m:1] to providelatched performance parameters PPL[m:1].

Performance parameter adjusted circuits 2020 may include a plurality ofcircuits. For example, performance parameter adjusted circuits 2020 caninclude an output buffer voltage generating circuit 2022, a DRAM refreshcircuit 2024, a word line low potential generating circuit 2026,P-channel IGFET body bias potential generating circuit 2028, N-channelIGFET body bias potential generating circuit 2030, output buffer circuit2032, an array potential generating circuit 2034, a peripheral potentialgenerating circuit 2036 and a VPP generating circuit 2038.

It is understood that a unique plurality (subset) of latched performanceparameters PPL[m:1] may be respectively provided to each performanceparameter adjusted circuits 2020 including output buffer voltagegenerating circuit 2022, a DRAM refresh circuit 2024, a word line lowpotential generating circuit 2026, P-channel IGFET body bias potentialgenerating circuit 2028, N-channel IGFET body bias potential generatingcircuit 2030, output buffer circuit 2032, array potential generatingcircuit 2034, peripheral potential generating circuit 2036 and VPPgenerating circuit 2038.

Performance parameter adjusted circuits 2020 may be used in asemiconductor device 100 when semiconductor device is a DRAM, forexample.

Referring now to FIG. 21, a semiconductor wafer including a plurality ofsemiconductor devices according to an embodiment is set forth in aschematic diagram and given the general reference character 2100. FIG.21 is a top plan view of semiconductor wafer 2100. Semiconductor wafer2100 may include a plurality of semiconductor devices 2102 contiguouslyformed on semiconductor wafer 2100. Semiconductor wafer 2100 may beessentially identical to semiconductor wafer 1300 of FIG. 13 exceptsemiconductor wafer 2100 may be divided into substantially more regions2110. Semiconductor wafer 2100 shows thirty regions 2110 (although notall are labeled with reference character 2110 to avoid unduly clutteringthe figure). Each region may include a semiconductor device 2114 (shownwith diagonal hatching) that is to be tested by a test apparatus 1400using a test method (such as test methods (300, 900, and 1200) so thatregional performance parameters for temperature ranges (W1 to W2 ^(n))may be determined. At a later step, regional performance parameters fortemperature ranges (W1 to W2 ^(n)) for each respective region 2110 maythen be programmed into performance parameter tables 170 for eachsemiconductor device 2102 within the respective region 2110.

Semiconductor wafer 2100 may include central regions 2120 which have atested semiconductor device 2124 and adjacent semiconductor devices 2122which may not be tested but may be programmed with regional performanceparameters based on the tested semiconductor device. Semiconductor wafer2100 may include edge regions 2130 that may include a testedsemiconductor device 2134 and adjacent semiconductor devices 2132 whichmay not be tested but may be programmed with regional performanceparameters based on the tested semiconductor device. The testedsemiconductor device 2134 may be selected to ensure there are nointervening semiconductor devices between tested semiconductor deviceand adjacent semiconductor devices 2132.

In this way, semiconductor device 2100 may include semiconductor devices2102 that are proximate to and adjacent the tested semiconductor device2114 in which regional performance parameters are obtained. By doing soa tighter current or speed performance window may be obtained in theoptimization procedure.

A temperature circuit may include, for example, temperature sensorcircuits (120 and 140) of FIG. 1.

A temperature circuit can provide a plurality of temperature ranges,each temperature range having a temperature range upper limit value anda temperature range lower limit value, with adjacent ones of theplurality of temperature ranges overlap. The temperature ranges may beutilized to provide performance parameters to performance parameteradjustable circuits to provide improved operating performance of thedevice over a wide range of temperatures.

Semiconductor device 100 can be a dynamic random access memory (DRAM),static random access memory (SRAM), non-volatile memory (such as a FLASHmemory device using floating gate memory cells or phase change RAM usingprogrammable resistive devices), processor, or general semiconductordevice, as just a few examples.

Each unique count value (CNT[n:1] or CNTP[n:1]) may select a set ofperformance parameters PP[m:1] that can be the performance parametersfor the temperature range (W1 to W2 ^(n)) corresponding to the uniquecount value (CNT[n:1] or CNTP[n:1]).

Other electrical apparatus other than semiconductor devices may benefitfrom the invention.

While various particular embodiments set forth herein have beendescribed in detail, the present invention could be subject to variouschanges, substitutions, and alterations without departing from thespirit and scope of the invention. Accordingly, the present invention isintended to be limited only as defined by the appended claims.

What is claimed is:
 1. A method, comprising the steps of: providing atemperature to a device; and outputting a count value that indicates atemperature range.
 2. The method of claim 1, further including the stepof: changing the magnitude of the temperature in a first temperaturedirection.
 3. The method of claim 2, further including the step of:incrementally changing the count value in a first count direction inresponse to the temperature reaching a first temperature threshold of atemperature window.
 4. The method of claim 3, further including thesteps of: reading the count value with a test apparatus; and storing thefirst temperature threshold in a storage medium in response to the stepof changing the count value.
 5. The method of claim 4, further includingthe step of: changing the magnitude of the temperature in a secondtemperature direction.
 6. The method of claim 5, further including thestep of: incrementally changing the count value in a second countdirection in response to the temperature reaching a second temperaturethreshold of the temperature window.
 7. The method of claim 6, furtherincluding the steps of: reading the count value with the test apparatus;and storing the second temperature threshold in a storage medium inresponse to the step of changing the count value.
 8. The method of claim1, wherein: the device is a semiconductor device.
 9. The method of claim8, wherein: the temperature is provided by a thermally conductive metalplate.
 10. The method of claim 9, wherein: the device is a packagedsemiconductor device including a heat spreader in direct contact withthe thermally conductive metal plate.
 11. The method of claim 1, furtherincluding the step of: placing the device in a test mode of operation.12. A method of claim 1, wherein: the device is a semiconductor deviceintegrally formed on a semiconductor wafer.
 13. A method of determininga plurality of first temperature range limit values in a semiconductordevice including temperature sensor circuits providing a plurality oftemperature ranges, each of the plurality of temperature ranges having afirst temperature range limit value, the method comprising the steps of:providing an initial temperature to the semiconductor device; providingan output value from the semiconductor device, the output valueindicating the temperature range in which the initial temperature islocated; incrementally changing the temperature in a first directionwhile monitoring the output value wherein a change in the output valueindicates a first temperature range limit value of the temperature rangein which the initial temperature is located.
 14. The method of claim 13,further including the step of: repeatedly incrementally changing thetemperature in the first direction while monitoring the output valuewherein each change in the output value indicates a first temperaturerange limit value for a respective one of the plurality of temperatureranges.
 15. The method of claim 14, further including determining aplurality of second temperature range limit values in the semiconductordevice including temperature sensor circuits providing the plurality oftemperature ranges, each of the plurality of temperature ranges having asecond temperature range limit value, the method including the steps of:repeatedly incrementally changing the temperature in a second directionwhile monitoring the output value wherein each change in the outputvalue indicates a second temperature range limit value for a respectiveone of the plurality of temperature ranges.
 16. The method of claim 15,further including the step of: storing the first temperature range limitvalues and the second temperature range limit values in a memory on atester.
 17. The method of claim 16, further including the step of:storing an average temperature value for each temperature range, theaverage temperature value being essentially an average of the firsttemperature range limit value and the second temperature range limitvalue for the corresponding one of the plurality of temperature ranges.18. The method of claim 17, further including the step of: providing atemperature having the average temperature value of at least one of theplurality of temperature ranges to the semiconductor device.
 19. Themethod of claim 13, wherein: the semiconductor device is a semiconductormemory device.
 20. The device of claim 13, wherein: semiconductor deviceis a processor.